TECOI is going to present to the 28th BIEMH three pioneering laser and plasma cutting machines and important technological developments of great relevence for the optimization of production processes.
On their booth they will show the following machines:
*LS DISK equipped with TRUMPF TruDisk solid state laser. TWIN DISK system with double laser cutting head for high production capacities and TECOI's exclusive BEVEL ARC® beveling system
*TEKNOS designed for cutting with high definition quality requirements, high production and large dimensions. The exclusive DRILLTEC system for high capability drilling will be incorporated to this machine.
*MULTY-N conceived exclusively for high capacity and top quality requirement plasma cutting. It incorporates the new IMZ® (Intelligent Movement Z-axis) process that is capable of saving up to 30% time thanks to its efficient movement algorithm.
CBM® (Cold Bevel Milling) designed to perform welding preparations for plate fabrication jobs by machining. This important development guarantees any chamfer geometry in a single pass with a null thermal contribution.